AJA Sputtering System

  • System can reach a base pressure ~ 4 x 10-8 Torr
  • The system contains 4 magnetron sputtering guns 2 DC and 2 RF which are of a true UHV design allowing baking to 200 °C without disassembly. The sputtering guns allow in-situ tilting of their heads without breaking vacuum. This permits the end user to optimize either uniformity or rate at any working distance in a very short amount of time without venting, resetting the angle, pump down and test. It also allows resetting the precise angle after target changes or source removal for service.
  • The system can handle substrates up to 4 inches in diameter and the substrate holder will allow simultaneous, rotation, heating, RF bias and deposition at up to 850 °C in suitable sputtering environment (600 °C in a pure Oxygen environment). Stability is to within ± 1 degree C, Deposition uniformity over 4" is better than ± 1.5 % and temperature uniformity is better than ± 1%.
  • A load lock chamber and cassette allows the samples to be removed and changed without venting the chamber. The cassette can hold up to 6 substrates holders.
  • The system features a user friendly "plug and play", LabView based computer control system which controls most of the common features including: gun power supplies, shutters, gas flow and pressure, and substrate heater.

3m Sputtering System


Heat Treatment Ovens:

The facility has two tube furnaces. The Lindberg 55322 oven is a Split-Hinge Single Zone Furnace with a Tmax = 1200 °C and a working tube of diameter 2.5 inches. And the Lindberg 54233 tube oven has an operating temperature of Tmax = 1500 °C and a working tube of diameter 2 inches.
Both ovens have programmable power supplies/temperature controllers and associated pump stations that can reach a base pressure 2 x 10-6 Torr. Applications include ashing, sintering, crystallizing, annealing, etc. The tube furnaces are used for crystal growth because of their small volume and precision with which the temperature can be controlled. The ends of the tubes do not get very hot and various adapters may be placed on the ends. This permits reactions under controlled atmosphere using reactive/un-reactive gases or a vacuum.

The E-Beam Evaporator

The facility also houses an E-beam evaporator recently purchased from AJA international. The E-beam system is very similar in design to the sputtering system. The system has the following features:

  • The system contains four material pockets for deposition of single and multilayers and alloys.
  • System can reach a base pressure ~ 5 x 10-9 Torr.
  • The system can handle 4 inch substrates which can be rotated and heated up to 850°C.
  • The system also has a load lock chamber for quick removal and insertion of samples.

Specimen preparation devices:

  • Emscope SC500 Au sputter coater
  • Diamond blade slow speed saw  
  • SBT Model 910 lapping and polishing machine 
  • Branson 2200 ultrasonic cleaner
  • VCR Group Inc. Dimpler D500i
  • Gatan Inc. Model 691 PIPS
  • Leica stereo microscope ZOOM 2000
  • Intek optical microscope



Prof. David Sellmyer, Faculty Supervisor
Dr. Shah Valloppilly, Specialist

Location: N. 110 Nanoscience Research Center
University of Nebraska
Lincoln, NE 68588-0298
phone: (402) 472-3693
e-mail: svalloppilly2@unl.edu
website: http://ncmn.unl.edu/matprep/home